ZAM 310H – Offline
ZAM310H Offline Precision Laser Depaneling Machine
The ZAM310H Offline Precision Laser Depaneling Machine provides high-accuracy, stress-free cutting for PCBs and FPCs using UV and CO₂ laser technology. It delivers clean, burr-free edges with minimal heat effect, supporting a wide range of materials including FR4, PI, LCP, ceramics, and RF substrates. With optimised cutting paths, advanced software, and a user-friendly interface, it ensures fast and reliable processing. Designed with cooling, dust extraction, and MES compatibility, the ZAM310H guarantees stable, efficient, and precise performance for batch and mass electronics production in automotive, telecom, and medical industries.
Specifications
| Item | ZAM310H |
| Platform Type | Single Platform |
| Processing Area | 350 × 350 mm |
| Repeat Accuracy | ±2 μm |
| Overall Accuracy | ±25 μm |
| X/Y Resolution | 1 μm |
| Max. Material Thickness | ≤2.0 mm |
| Platform Structure | Steel Structure |
| Motor Type | Servo Motor |
| Laser Type | Nanosecond |
| Laser Power | 15 W |
| Telecentric Lens Range | 50 × 50 mm f=100 mm (Domestic Galvo) |
| CCD Structure | Coaxial |
| Positioning Accuracy | 0.01 mm |
| Camera Resolution | 1.3 MP |
| Control Software | DreamCreaTor 3 |
| Data Processing Software | Circuit CAM 7.5 Standard |
| File Formats | LMD, Standard Gerber (RS-274-D), Extended Gerber (RS-274-X), DXF, Excellon, Sieb & Meier, HP-GL, Barco DPF, ODB++ |
| Working Environment | 22℃ ± 2℃ |
| Power Supply | 380 VAC / 50 Hz / 2 kW |
| Weight | Approx. 580 kg |
| Dimensions (L × W × H) | 930 × 1270 × 1600 mm |
The ZAM310H Offline Precision Laser Depaneling Machine is a high-performance solution for precise, stress-free separation of PCBs and flexible circuits. Built for demanding industries, it combines advanced UV and CO₂ laser technology with intelligent software to deliver consistent, burr-free results.
Precision Laser Cutting
UV laser: ultra-fine cut width of 25–40 μm, minimal thermal impact, no carbonisation
CO₂ laser: cut width of 120–220 μm, excellent for resin-based materials
Non-contact cutting prevents mechanical stress and damage
Supports a wide range of materials, including PCBA, FPC, LCP, MPI, PI, PET, FR4, FR5, CEM, HTCC/LTCC ceramics, and RF materials
Flexible Offline Operation
Optimised cutting paths for higher efficiency and shorter cycle times
Powerful graphic editing software for fast data processing
Easy-to-use GUI interface with a low learning curve
Optional advanced functions: pulse following, drilling, and Skywriting for enhanced control
Versatile Applications
The ZAM310H is ideal for:
FPC outline cutting
PCBA depaneling
Coverlay window cutting
Gold finger processing
High-reliability applications in automotive, telecom, medical, and consumer electronics
Industrial-Grade Reliability
Stable platform and precision motion system for accuracy
Advanced cooling and dust extraction ensure clean operation
Seamless integration with MES systems for real-time data and traceability
Designed for batch and mass production with consistent performance
The ZAM310H Offline Precision Laser Depaneling Machine delivers unmatched precision, flexibility, and efficiency. Whether used for FPCs, PCBAs, or specialised materials, it is the perfect choice for manufacturers who demand superior quality and high productivity in electronic assembly.
